Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap ...
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High brightness LEDs are mounted directly on a heat pipe or are mounted on a substrate, which is mounted on the heat pipe. The heat pipe can be a common ...
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Cree, Inc. announced on Monday December 19 that it has granted five innovative LED lighting manufacturers licenses to select Cree patents through its recently ...
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An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface ...
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A LED package structure is disclosed. The LED package structure includes a substrate, a light emitting diode, a plasma chemical vapor deposition layer and a ...
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The invention discloses an LED luminaire, in the case of which an LED module is applied to the luminaire body such that the height of the luminaire body and ...
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Method and system are disclosed for compensating for color variations due to thermal differences in LED based lighting systems. The method and system involves ...
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Morrisville, NC, May 11, 2007 - LED Lighting Fixtures, Inc. (LLF) today announced that the U.S. Patent Office has issued LLF’s first patent # 7,213,940. The ...
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A light emitting diode (LED) driver to drive an LED, including a current adjusting unit to adjust magnitude of a current flowing on the LED by supplying power ...
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