LpR49_962675.pdf

Content: > International Year of Light 2015 > Wafer Level Packaging > Thermal Management of LEDs > Tech-Talks Bregenz: Daniel Doxsee Commentary A Confusing Situation that Demands Solutions: Performance Specification by Jacob Nuesink, DEKRA Certification (p 06) Events First EBV Lighting Academy Summary Report by Arno Grabher-Meyer, LED professional (p 40) Tech-Talks Bregenz Daniel Doxsee, Deputy Managing Director – Nichia Chemical Europe compiled by Dr. A. Prasad, LED professional (p 48) Research A Self-Compensation Approach for Maintaining the Chromaticity Coordinates of Phosphor Converted LEDs Upon Temperature Variations by Wolfgang Nemitz et al., Joanneum Research (p 54) Technologies 3-Pad LED Flip Chip COB by Pao Chen, Flip Chip Opto (p 62) Practical Estimation of Materials and Measures for Thermal Management of LEDs by Giles Humpston, Cambridge Nanotherm (p 66) Analytical and Numerical Studies on the Influence of the Thermal Conductivity of TIMs on the Case Temperature of LED Systems by Vinay Pal, Nikhil Aggarwal & Rajeev Jindal, Moserbear (p 70)